| Name | Model | Quantity | Maximum PCB Width | Specifications |
|---|---|---|---|---|
| Printing press | GKC-G5/GLS/DEK | 4 | 50*50mm-500*340 thickness0.4-6mm | Printing accuracy ±0.025mm, easily achieving printing adjustments of 01005 mm (XY ±5M, angle 2°). |
| SPI | REFINE-XVSP-3000TR700TL | 3 | 50*50-460*410 thickness0.4-5mm | PCB component height ±30mm, height detection range 0-550um, height detection 0.1um, testing speed 0.35Sec/FOV |
| Pick-and-place machine | YSM20/YSM10/YSM20R NPM-W2(16+16) NPM-W2(8+3+Tray) CM602L Japan NPM-W2(H16+H3) | 8 | YSM20:50*50mm-810*490mm YSM10:50*50mm-510*460mm | Placement accuracy ±0.025mm; suitable for mounting sizes from 03015 to W55*L100mm with a height of 15mm or less. YSM20: Nozzle 20; 90,000 CPH (under our preferred conditions) YSM10: Nozzle 10; 460,000 CPH (under our preferred conditions) |
| Reflow soldering machine | JTK-1000- N JTE-1000 | 4 | 50-450mm | Number of heating zones: 10 (upper) / 10 (lower) Temperature control accuracy: ±0.1°C Transport speed: 300mm-2000mm/min |
| AOI | JUTI/V5000H/YS-A6500 3D SPI | 3 | 50*50-410*350mm thickness0.4-5mm | It can measure IC as small as 0.1005 and 0.3 PITCH, with a positioning accuracy of 0.018 mm. |
| Wave soldering machine | MPS-350 | 1 | 50mm-350mm | Allowable PCB component height (top 120mm, bottom 25mm), guide rail angle 4°-7°, transport speed 0-1800mm/min |
| X-ray | U-5200L | 1 | 50*50mm-460*410mm thickness 0.4-5mm | PCB component height ±30mm; Height detection range 0-550mm |
| Fully automatic laser engraving machine | 450C | 1 | 55*55mm 400*400mm | Substrate thickness: 0.5-4mm; Height range: 0.3-30mm; Working diameter: 900±20mm; Minimum engraving size: 10*10 (10-bit English) |
| First article inspection instrument | LIQ-550 | 1 | 420*300mm | Intelligent analysis and testing of specifications and errors (automatic recognition upon BOM import). Similar to AOI image visual inspection for large crystal components, detecting reversed, incorrect, or missing parts. Measuring resistance, capacitance, and inductance (coil), automatically determining PASS/FALL. L: 0.1UH~99KH (coil inductance); C: 0.1PF~9.9PH; R: 0.1Ω~99.9MΩ. Selectable frequency: 20-100K. Basic measurement accuracy: 0.05%. |
PCB Manufacturing capabilities
Rigid, Flex, Rigid-Flex, Metal Core, HDI, High-Frequency, High-TG
Max Number of PCB Layers: Up to 48 Layers
Max Circuit Board Size: 23.62″x 39.37″ (599.95 mm x 1000 mm)
Min Trace/Space: 2 mil (0.05mm)
Core Material: ≥2mil（0.05mm）
Min Laser Drill Size: 3 mil (0.0762mm)
Max Inner/Outer Copper: 5oz / 11 oz
Controlled Impedance +/-7%
Hole Size Tolerance: NPTH:±2mils(±0.05mm) PTH:±3mils(±0.075mm)
Blind / Buried Vias
Min. Dielectric Thickness : 2mil(0.05mm)
Material: FR4, FR4 High Tg, Aluminum, Rogers, Arlon, etc.
Surface: Lead Solder (HASL), Lead Free Solder(HASL – LF), ENIG, Immersion Silver, Immersion Tin, OSP, Hard Gold, Flash Gold, etc.
RoHS Compliant
Class II & Class III
UL certified
ISO 9001
Panelization
Stencil Design